Intel– tag –
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SILITH Technology Receives First Mass-Produced Silicon Photonics Wafers from UMC’s Singapore 12-inch Fab
Semiconductor Today Singapore Overview SILITH Technology, a Singaporean fabless silicon photonics company, has received its first mass-produced photonic IC wafers from UMC's 12-inch fab in Singapore. This collaboration aims to scale up n... -
Taiwan’s TGV Glass Substrate Supply Chain Advances: E&R Engineering Ships Laser Modification Equipment to US Client, Accelerating Mass Production
Taiwan News Taiwan Overview Driven by escalating HPC demand, glass substrates are emerging as a next-generation advanced packaging solution, leading to the formation of a robust Through-Glass Via (TGV) supply chain in Taiwan. E&R Eng... -
CoWoS Identified as Core Bottleneck for AI GPU Shipments, Distinct from HBM Shortage
BiyaPay Blog International Overview CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology integrating GPUs, HBM, and chiplets; its limited capacity forms a critical manufacturing integration bottleneck for AI GPU shipmen... -
NVIDIA’s AI Chip Supply Bottleneck Stems from TSMC’s Booked CoWoS Capacity, Intel EMIB Emerges as Alternative
BingX International Overview TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity is fully booked through 2026, with 52-78 week lead times, posing a severe supply bottleneck for NVIDIA. While NVIDIA reportedly secures 60... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
Marvell Technology Accelerates Co-Packaged Optics (CPO) Deployment to Revolutionize AI Scaling
Marvell Technology (YouTube) USA Overview Marvell Technology is accelerating the deployment of Co-Packaged Optics (CPO) as the next leap in AI infrastructure scaling. CPO revolutionizes data center connectivity by directly integrating co... -
ASML to Increase EUV and DUV Capacity by Nearly One-Third Annually to Alleviate AI Chip Supply Chain Concerns
ET Electronics News India Overview ASML, a leading semiconductor equipment supplier, announced an annual production capacity increase of nearly one-third (approximately 33%) for its flagship EUV and DUV tools. This expansion aims to meet... -
ASML Scales Up to Meet AI Chip Demand Surge, Elevates 2026 Outlook
TheFlghts Europe Overview ASML, the dominant provider of lithography equipment, is significantly expanding its production capacity for advanced AI chips in response to unprecedented global demand. The company has consequently raised its ... -
Intel Announces €5 Billion Expansion in Ireland to Boost Next-Generation AI and Data Center Chip Production
Simply Wall St USA Overview Intel announced a €5 billion expansion of its Leixlip, Ireland campus to significantly increase output of next-generation AI and data center chips, including Intel Xeon 6 processors. This investment is part of...
