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NVIDIA to Unleash ‘Rubin’ AI Platform in 2026, Integrating Next-Gen GPU, CPU, and Networking Technologies
The Daily Star Bangladesh Overview NVIDIA has announced the 2026 release of 'Rubin,' its next-generation AI chip platform, designed to dramatically elevate AI performance through tightly integrated, advanced GPUs, CPUs, and networking ch... -
Hitachi, Intel K.K., AIST Partner with NEDO to Develop 1000-Qubit Silicon Quantum Computer by 2029
EIN Presswire Japan Overview Hitachi, in collaboration with Intel K.K. and AIST, has been selected for a NEDO project to accelerate the development of next-generation silicon quantum computers by March 2029. The project aims to develop t... -
Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging
Jooble USA Overview Intel is recruiting a Senior Module Test Engineer in Kulim, Malaysia, to lead the design and development of advanced manufacturing test processes. This role supports post-packaging burn-in, final test, and system test... -
AI Chip Packaging Bottleneck Intensifies: NVIDIA Explores Intel EMIB Amid TSMC CoWoS Shortage, Amkor Commits $7B to Arizona
The Economy Japan Overview The burgeoning AI chip market faces a critical bottleneck in advanced packaging, particularly with TSMC's CoWoS technology, prompting NVIDIA to reportedly consider Intel's EMIB for future GPU production. This s... -
Marvell Technology Strengthens On-Chip Optical Expertise with Celestial AI Acquisition, Leading AI Market with 1.6T and 3.2T Optical Solutions
Kavout USA Overview Marvell Technology is strategically addressing the need for faster, more efficient data movement within and between AI clusters by integrating Celestial AI's on-chip optical expertise into its portfolio. Its electro-o... -
Ion-Beam Origami Cuts 3D Optical Chip Fabrication to Seconds, Achieving >100x Speedup Over Conventional Methods
Intelligent Living International Overview Researchers have developed 'Ion-Beam Origami,' a technique capable of fabricating 3D photonic nanostructures across an entire wafer in mere seconds. This breakthrough achieves over 100x speed imp... -
Advanced AI Optical Chip Technologies Fuel Strong Growth Across Next-Generation Computing Applications
Semiconductor-knowledge-hub International Overview The AI optical chip market is experiencing significant expansion driven by the growth of AI and machine learning applications. AI optical chips utilize light for data transmission and pr... -
Marvell Asia Leads Optical Transceiver Photonic Integration Patents Amidst Accelerating Entry of TSMC, Intel, and Other New Players
Patsnap International Overview The field of photonic integration for optical transceivers is experiencing active growth, with Marvell Asia holding the lead in patent families. New entrants like TSMC, Intel, Lyte AI, and Lipac indicate wi... -
YieldWerx Analyzes 2026 Photonics & Optical I/O Trends: In-Package Optical I/O Becomes Essential for AI Workloads
yieldWerx USA Overview YieldWerx has released an analysis of key trends and challenges in photonics and optical I/O for 2026, highlighting that optical interconnects are undergoing a dramatic shift from system-to-system to in-package com... -
STMicroelectronics Launches 300mm Wafer Production of PIC100 Silicon Photonics for AI Data Centers
EE Times International Overview STMicroelectronics has begun mass production of its PIC100 silicon photonics platform on 300mm wafers to meet the escalating demands of AI data centers. This platform integrates BiCMOS for laser drivers wi...
