Intel– tag –
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Hitachi Leverages Intel’s 18A Process for Mass Production Development of 1000-Qubit Class Silicon Quantum Computers
MONOist - ITmedia Japan Overview Hitachi announced it will commence R&D for mass production of silicon quantum computers, utilizing Intel's cutting-edge 18A process technology, after being selected for a NEDO subsidy program. The pro... -
Supercomputing News Emphasizes Critical Role of Advanced Packaging (CoWoS, EMIB, T-AI) in AI Accelerators
Supercomputing News Global Overview Supercomputing News published an analytical article emphasizing the critical role of advanced packaging technologies like CoWoS, EMIB, and T-AI in enhancing AI accelerator performance. These technologi... -
New Market Pitch Compares Chip-to-Chip Interconnect Startups, Analyzes Marvell’s Celestial AI Acquisition Impact
New Market Pitch USA Overview New Market Pitch analyzed Marvell's acquisition of Celestial AI, suggesting new value creation opportunities for chip-to-chip interconnect startups. Celestial AI's Photonic Fabric technology was acquired by ... -
Former Intel CEO Patrick Gelsinger Lauds PsiQuantum’s $125M DARPA Contract as ‘Transformative’
Wccftech USA Overview Former Intel CEO Patrick Gelsinger praised PsiQuantum's $125 million contract with DARPA as 'transformative.' PsiQuantum is developing a silicon photonics platform aiming for 'utility-scale quantum computing' to sol... -
CPO Shipments Intensify as Four Foundries Pursue Diverse Paths in Next-Gen Optical Integration
MLQ News Global Overview As Co-Packaged Optics (CPO) shipments scale up, four major semiconductor foundries—TSMC, Intel, Samsung Foundry, and GlobalFoundries—are pursuing distinct strategies for next-generation optical integration. TSMC ... -
Major Foundries Advance CPO Roadmaps as NVIDIA Spectrum-X and Broadcom Taurus BCM83640 Enter Mass Production and 400G/Lane DSP Era
Tom's Hardware USA Overview Leading foundries (TSMC, Intel, Samsung, GlobalFoundries) are aggressively pursuing Co-Packaged Optics (CPO) roadmaps to address scale-up connectivity bottlenecks in AI clusters. NVIDIA has initiated mass prod... -
Hitachi, Intel, and AIST Launch NEDO-Backed Silicon Quantum Computing Project, Targeting 100-Qubit Error-Corrected Prototype by FY2028
Quantum Computing Report Japan Overview Hitachi, Intel, and the National Institute of Advanced Industrial Science and Technology (AIST), with support from Japan's New Energy and Industrial Technology Development Organization (NEDO), have... -
Hitachi, Intel, AIST Unveil NEDO Project for 50-Qubit Silicon Quantum Chip with Intel 18A Process
Zaikei Shimbun Japan Overview Hitachi, Intel Japan, and AIST have launched a NEDO-backed project to develop silicon quantum processors using Intel's 1.8nm 'Intel 18A' process technology. This ambitious collaboration aims to deliver a 50-... -
Intel Foundry Leverages U.S. Advanced Packaging (Foveros, EMIB) to Power Next-Gen AI Semiconductors
Intel Newsroom USA Overview Intel Foundry is accelerating the realization of next-generation AI semiconductors through its advanced packaging technologies developed in U.S. facilities. Utilizing Foveros stacking, EMIB silicon bridges, an... -
Intel and Lens Technology Form Strategic Alliance to Accelerate Glass Substrate-Based Advanced Semiconductor Packaging for AI Era
Intel Newsroom USA Overview Intel and Lens Technology announced a strategic collaboration to accelerate the development of glass substrate-based packaging solutions for advanced semiconductors, critical for the AI era. This partnership a...
