Intel– tag –
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Diraq Unveils Roadmap Targeting Over 2 Million Physical Qubits on a Single Silicon Chip by 2031
Quantum Zeitgeist Australia Overview Australian quantum computing firm Diraq has published an ambitious technology roadmap aiming to integrate over 2 million physical qubits on a single silicon chip by 2031. This plan leverages existing ... -
TSMC SVP Reports 90% Surge in Equipment Orders in Six Months Driven by AI Demand: Equivalent to Building 20 Fabs Globally Simultaneously
TechSoda Taiwan Overview TSMC Senior VP Cliff Hou reported an astonishing 90% surge in equipment orders over six months, driven by AI demand far exceeding forecasts, equivalent to constructing nearly 20 fabs worldwide simultaneously. Uni... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
Intel’s EMIB-T Advanced Packaging Projected for Significant Contribution by 2029 as CoWoS Constraints Drive Google’s Interest
TrendForce Taiwan Overview Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology, particularly EMIB-T, is attracting strong interest from major tech firms like Google amid persistent TSMC CoWoS supply constraints. Intel projec... -
Intel to Unveil AI Infrastructure Innovations at AI Infra Summit 2026, Detailing Edge-to-Cloud Scaling Strategy and CEO Keynote
Intel USA Overview Intel announced it will showcase its vision and progress for scaling AI across edge, enterprise, cloud, and physical AI environments at the AI Infra Summit 2026. Company experts will illustrate how Intel's technology, ... -
Intel Unveils Next-Gen Processors for Agentic AI at Hot Chips 2026: Featuring 256-Core Diamond Rapids CPU and Inference-Optimized Crescent Island GPU
TechRadar USA Overview Intel showcased its next-generation hardware architectures optimized for agentic AI workloads at Hot Chips 2026. The lineup includes the "Wildcat Lake Core Series 3 SoC" for client and edge devices, the "Crescent I... -
SK hynix’s MR-MUF and Samsung’s TC-NCF Revolutionize Thermal Management in AI Semiconductor HBM: Driving Advanced Packaging Evolution
USD Analytics Global Overview The evolution of AI is driving significant changes in semiconductor packaging and High Bandwidth Memory (HBM) technologies, with SK hynix's Advanced MR-MUF and Samsung's TC-NCF technologies solving critical ... -
Ajinomoto Fine-Techno to Expand ABF Film Production Capacity, Anticipates Easing AI Chip Supply Shortages by Early 2027
The Wall Street Journal Japan Overview Ajinomoto Fine-Techno disclosed plans to significantly boost its production capacity for Ajinomoto Build-up Film (ABF) film across multiple manufacturing sites, driven by exploding demand for AI chi... -
Samsung Electro-Mechanics Boosts FC-BGA Substrate Capacity by 20% for AI/HPC, Enhances Competitiveness with Fine-Pitch Wiring
The Korea Economic Daily South Korea Overview Samsung Electro-Mechanics (SEMCO) announced a 20% expansion of its high-end FC-BGA substrate production capacity in South Korea, driven by surging demand from AI/HPC applications. This strate...
