Intel– tag –
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Google’s Next-Gen TPUs Adopt Intel EMIB Packaging, Achieve Yield Targets in First Mass Production
digitimes Taiwan Overview Google has successfully implemented Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technology for mass production of its next-generation TPUs, already achieving yield targets. This strategic mov... -
Socionext Expands SoC Roadmap with Intel 18A-P Process, Bolstering Next-Gen Opto-Electronic Device Integration
Design And Reuse Japan Overview Socionext has broadened its System-on-Chip (SoC) roadmap by adopting Intel's advanced 18A-P process technology. This strategic move strengthens the foundation for supporting complex integration required fo... -
Hot Chips 2026: Intel Unveils Crescent Island AI Accelerator Details, Targeting Maximum AI FLOPS per Watt with Larger Caches & Deeper XMX Engines
Tom's Hardware USA Overview At Hot Chips 2026, Intel revealed details of its next-gen 'Crescent Island' AI accelerator, designed with larger caches and deeper XMX engines to maximize AI FLOPS per watt. Notably, its FP64 processing suppor... -
Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory
Chinadaily.com.cn China Overview Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased ... -
Japan’s Shinko Electric Develops 22-Layer Glass Substrates for AI Chips, Resolving Internal Cracking and Delamination Issues
TrendForce Japan Overview As AI chips demand larger packages, intensifying competition in glass substrates, Japan's Shinko Electric Industries has successfully developed 22-layer glass substrates with 11 copper wiring layers on each side... -
Intel Accelerates Co-Packaged Optics (CPO) Development to Strengthen AI Data Center Market Presence
Simply Wall St USA Overview Intel is intensifying its strategic focus on AI data center infrastructure by accelerating the development of Co-Packaged Optics (CPO) and related connectivity solutions. This initiative aims to address the cr... -
Leading Optical Transceiver Manufacturers Drive Silicon Photonics into Mainstream Production in 2026; Intel, Cisco, Marvell, Coherent Launch SiPh Products
FB-LINK Technology China Overview In 2026, silicon photonics (SiPh) product shipments are entering full swing, with major players like Intel, Cisco, Marvell, and Coherent actively launching SiPh-based transceiver modules. SiPh already co... -
AI Chip Race Shifts to Advanced Packaging as 130M Accelerators Ship; TSMC’s CoWoS Dominates, Intel Pursues Alternatives
The Korea Economic Daily South Korea Overview The competitive landscape in the AI semiconductor market is shifting from process nodes to advanced packaging, with over 130 million AI accelerators projected to ship with advanced-packaged o... -
Intel Partners with Lens Technology to Revolutionize Advanced Semiconductor Packaging for AI Era
Storage Newsletter USA Overview Intel has announced a strategic collaboration with Lens Technology, leveraging its expertise in glass materials, high-precision laser processing, and advanced manufacturing. This partnership is designed to... -
Intel Foundry Boosts AI Data Center Compute with Foveros and EMIB Advanced Packaging, EMIB-T Launch Planned for 2026
ET Datacenters India Overview Intel Foundry is actively deploying advanced packaging technologies, including Foveros stacking and Embedded Multi-die Interconnect Bridge (EMIB) interconnects, to meet the escalating demands of AI workloads...
