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TSMC Moves to Large-Format Glass Substrates with CoPoS to Address CoWoS Capacity for AI Chips, Targeting 2028-2029 Mass Production
36Kr, Semiconductor Industry Watch, AI Weekly Taiwan Overview TSMC has launched a pilot line for its CoPoS (Chip-on-Panel-on-Substrate) advanced packaging at Taiwan's VisEra, aiming to alleviate the critical CoWoS capacity bottleneck for... -
SEMICON West Relocates to Phoenix, Arizona, Bolstering U.S. Semiconductor Hub with TSMC’s $100 Billion Advanced Fab Plans
Arizona Commerce Authority USA Overview SEMI announced the permanent relocation of SEMICON West to Phoenix, Arizona, adopting an annual spring schedule from March 30 – April 1, 2027. This move reflects Arizona's rapid expansion as a semi... -
Intel Accelerates Next-Gen AI Semiconductor Development in U.S. Fabs with Foveros and Enhanced EMIB-T Packaging
Intel USA Overview Intel is aggressively advancing next-generation AI semiconductor development in its U.S. fabs by leveraging cutting-edge advanced packaging technologies such as Foveros stacking, EMIB silicon bridges, and particularly ... -
Intel’s EMIB Dominates AI Packaging with Google Adoption, Prompting TSMC to Develop Similar Tech Amidst CoWoS Constraints
Benzinga USA Overview Intel's EMIB technology is establishing a significant competitive advantage in advanced chip packaging for AI workloads, exemplified by Google's adoption of EMIB-T in its 9th-generation TPUs. Facing CoWoS capacity f... -
Ayar Labs Accelerates Commercial Deployment of Optical I/O Chiplets to Revolutionize AI/HPC Performance, Breaking Data Center Bottlenecks
Lightwave Online United States Overview Ayar Labs has announced new partnerships to accelerate the commercial deployment of its silicon photonics-based optical I/O chiplets. This technology directly integrates optical interconnects with ... -
Wooptix Unveils Astronomy-Inspired Tech to Resolve ‘Optical Bottleneck’ in AI Chip Packaging, Boosting Yield and Performance
EE Times USA Overview Wooptix has announced a groundbreaking new technology that applies adaptive optics, originally developed for astronomy, to resolve the 'optical bottleneck' in advanced AI chip packaging. This innovation dramatically... -
NVIDIA’s AI Financing Story Gains Momentum, Accelerating Funding Strategy and Investor Confidence
Kalkine Media USA Overview NVIDIA is accelerating its strategic financing activities to strengthen its leadership at the forefront of AI technology. Through continuous investment in GPU technology and the CUDA software platform, the comp... -
AI Chip Showdown: NVIDIA, AMD, and Intel Ignite New Battleground in 2026 with Blackwell Ultra and Instinct MI400
CryptoBriefing International Overview The AI chip race is set to intensify dramatically in 2026, as NVIDIA's 'Blackwell Ultra' and AMD's Instinct MI400 series usher in a fierce new phase of competition against Intel. These tech giants ar... -
Nvidia Dominates H1 2026 AI Chip Market with 75-81% Revenue Share, While AMD and Intel Gain Momentum with OpenAI Partnership and New GPU Sampling
The Motley Fool USA Overview Nvidia retained a dominant 75-81% revenue share in the AI accelerator market during the first half of 2026. However, AMD is strengthening its position through a strategic partnership with OpenAI, and Intel is... -
TSMC and Kinsus Jointly Developing New AI Chip Packaging Technology Akin to Intel’s EMIB to Address CoWoS Capacity Constraints
Tech in Asia Singapore Overview TSMC is reportedly collaborating with Kinsus to develop a novel AI chip packaging technology, resembling Intel's Embedded Multi-die Interconnect Bridge (EMIB), to alleviate the tight supply of CoWoS capaci...
