Intel– tag –
-
Semiconductor Industry Pivots to Heterogeneous Large-Scale Integration (HLSI) as AI Reshapes Chip Design
Next Move Strategy Consulting (via EE Times) USA Overview Driven by surging AI workloads, the semiconductor industry is dramatically shifting beyond traditional System-on-Chip (SoC) paradigms towards Heterogeneous Large-Scale Integration... -
Intel’s EMIB-T Emerges as CoWoS Alternative, New XBM Memory Architecture to Alleviate AI Memory Bottleneck
Tom's Hardware USA Overview Intel's 2.5D packaging technology, EMIB-T, is emerging as a credible alternative to TSMC's CoWoS for large-package AI accelerators, expanding validation for 36/35 µm bump pitch to 4.5x reticle silicon packages... -
TSMC Significantly Expands CoWoS Advanced Packaging Capacity, to Begin Production of 14-Reticle-Size Packages by 2028 for Surging AI Demand
Biya Global Limited Taiwan Overview TSMC is substantially expanding its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity to meet the surging demand for AI chips. The company aims to nearly quadruple CoWoS capacity to 130,00... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
openPR.com Predicts AI Data Center Optical Interconnect Market to Reach $41.09 Billion by 2035, Driven by Intel’s Demonstrated Co-packaged Optics
openPR.com USA Overview This article provides an overview of a market research report published via openPR.com, forecasting the optical interconnect market in AI data centers to reach $41.09 billion by 2035. Growth is driven by increasin... -
Seeking Alpha: Marvell’s $3.25B Celestial AI Acquisition and 3.2T Optical Transceiver Development Bolsters AI Market Competitiveness
Seeking Alpha USA Overview According to Seeking Alpha, Marvell Technology acquired Celestial AI for $3.25 billion in February 2026, gaining its advanced Photonic Fabric technology. This acquisition aims to enhance memory transfer efficie... -
Market Intelo Predicts Growth in Photonic AI Interconnect Fabric Market Driven by AI Model Complexity and Data Center Efficiency
Market Intelo USA Overview This article provides an overview of a market research report published by Market Intelo, analyzing the current state and future growth of the Photonic AI Interconnect Fabric Market. Key drivers identified incl... -
Intel Market Research: LiDAR Silicon Photonic Chip Market Driven by ADAS and Autonomous Vehicle Demand, 2026-2034
Intel Market Research USA Overview This article provides an overview of a market research report published by Intel Market Research. The report forecasts that the LiDAR silicon photonic chip market will be significantly driven by the pro... -
Photonic IC Market Surges as AI Data Centers and High-Speed Networking Drive New Technology Initiatives from Infinera, Intel, NVIDIA, and more
openPR.com USA Overview The photonic IC market is rapidly expanding, propelled by demand from AI data centers and high-speed networking. Infinera leads in InP-based PIC design, while Intel, NVIDIA, Fujitsu, NEC, Cisco, Broadcom, and NTT ... -
NVIDIA Unveils “RTX Spark” AI Chip for PCs, Intel Boosts Industrial Edge AI with Core Ultra Series 3, AMD Eyes NPU-Powered Ryzen for Market Dominance
AI Chips News USA Overview NVIDIA announced its "RTX Spark" AI chip for personal computers on July 4, 2026, set to debut this fall in new Windows PCs from major manufacturers like Lenovo and Microsoft Surface. Concurrently, Intel is enha...
