NVIDIA– tag –
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StarCloud One Deploys NVIDIA H100 GPUs in Orbit, While China and India Accelerate Space-Based AI Data Center Development
Business Standard India Overview StarCloud One successfully deployed NVIDIA H100 GPUs into orbit, demonstrating the operational viability of AI chips in space environments. This initiative reflects a global surge in interest for space-ba... -
Google Cloud and Nvidia Accelerate Orbital Data Center Initiatives to Address Earth’s AI Compute Limitations
Space Economy Institute USA Overview Facing escalating AI compute demands, Google's Project Suncatcher and Nvidia are driving the development of space-based AI systems to circumvent terrestrial data center constraints. Orbital data cente... -
SK Hynix to Heavily Invest in ASML EUV for HBM Production in Yongin and Cheongju, Expanding Indiana Packaging Facility
Seeking Alpha South Korea Overview SK hynix plans to extensively deploy ASML's EUV (Extreme Ultraviolet) lithography equipment at its Yongin Semiconductor Cluster and Cheongju advanced packaging facilities, significantly bolstering High-... -
Semiconductor Industry Pivots to Heterogeneous Large-Scale Integration (HLSI) as AI Reshapes Chip Design
Next Move Strategy Consulting (via EE Times) USA Overview Driven by surging AI workloads, the semiconductor industry is dramatically shifting beyond traditional System-on-Chip (SoC) paradigms towards Heterogeneous Large-Scale Integration... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
Micron Invests $9.3 Billion in Hiroshima for HBM Production Launching 2028, Expands Packaging Capacity in Singapore
TechsCurrent Japan Overview Micron Technology has broken ground on a $9.3 billion expansion of its Hiroshima, Japan factory to bolster High-Bandwidth Memory (HBM) production, with shipments expected around summer 2028, supported by Japan... -
HBM and ABF Shortages Intensify AI Chip Supply Bottlenecks, Ajinomoto Forecasts Over 20% ABF Supply Gap by 2027
Semiconductor Engineering USA Overview The primary bottlenecks for AI chip production are the critical shortage of High-Bandwidth Memory (HBM) and the complex packaging capacity required for GPUs/XPUs by Nvidia, AMD, and Google, coupled ... -
TSMC Significantly Expands CoWoS Advanced Packaging Capacity, to Begin Production of 14-Reticle-Size Packages by 2028 for Surging AI Demand
Biya Global Limited Taiwan Overview TSMC is substantially expanding its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity to meet the surging demand for AI chips. The company aims to nearly quadruple CoWoS capacity to 130,00... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
Nvidia Kicks Off Volume Production of Blackwell AI Accelerators with TSMC’s CoWoS-L, Supply to Remain Tight Through Q4
MetalSemi Asia Taiwan Overview Nvidia has commenced volume production of its next-generation Blackwell AI accelerators at TSMC, leveraging the 4NP process and advanced CoWoS-L packaging. Cloud service provider demand is projected to outs...
