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Intel and Tesla Partner on AI6 Data Centers, Tapping Advanced Packaging for Production at Austin’s ‘Terafab’
Jamie's Substack USA Overview Tesla has announced a strategic partnership with Intel Foundry Services to scale its AI6 chip-powered data center clusters, extensively utilizing Intel's advanced packaging technologies. The collaboration wi... -
Advanced Packaging’s Evolution: 2.5D/3D Integration, Chiplets, and Hybrid Bonding Propel AI and HPC
Springer Professional Germany Overview Semiconductor packaging technology has dramatically evolved from 2D to 2.5D and 3D IC integration, a transformation accelerated by the explosive demand from AI and High-Performance Computing (HPC). ... -
Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)... -
NVIDIA Locks Down Multi-Year HBM Supply Deals, Anticipating Persistent Shortages Beyond 2028
gagadget.com USA Overview NVIDIA CEO Jensen Huang recently visited South Korea, securing multi-year agreements with key partners including SK Hynix, SK Telecom, Naver, and Doosan Group for High Bandwidth Memory (HBM) supply, AI cloud inf... -
Samsung to Establish Gwangju Advanced Packaging Facility, Eyes Full HBM Hybrid Bonding Transition by 2029
TrendForce South Korea Overview Samsung Electronics is reportedly considering a new advanced semiconductor packaging plant in Gwangju, South Korea, with investment plans potentially announced by June 2026. This strategic facility will fo... -
SK Hynix Boosts HBM4 Production with Major TC Bonder Order from Hanmi Semiconductor
The Korea Herald South Korea Overview SK Hynix has made a significant investment, ordering ₩44.2 billion (approx. $28.7 million USD) worth of advanced 'TC Bonder 4.5 Griffin' thermo-compression bonders from Hanmi Semiconductor. This stra... -
TSMC to Boost CoWoS Capacity Tenfold to 130K Wafers/Month by Late 2026, Accelerates Glass-Substrate CoPoS for AI Chips
Tom's Hardware USA Overview TSMC is aggressively expanding its advanced packaging capacity, projecting a tenfold increase in CoWoS production to over 130,000 wafers per month by the end of 2026 to meet surging AI demand. Despite this, de... -
NTT, SK Group, and Chunghwa Telecom Invest $500 Million in ‘IOWN AI Fund’ to Address AI Power Consumption Challenges
Telecoms Tech News UK Overview NTT, SK Group, and Chunghwa Telecom have established the $500 million 'IOWN AI Fund' to address the power consumption challenges in AI infrastructure, based on NTT's Innovative Optical and Wireless Network ... -
Data Gravity Analysis: AI Interconnects Shift from Copper to Optical, with NVIDIA Leading with CPO-Equipped Spectrum-X Switches
Data Gravity USA Overview Data Gravity's analysis indicates that frontier AI performance constraints are shifting from accelerator supply to interconnects, highlighting challenges in chip-to-chip, GPU-to-GPU, and rack-to-rack connectivit... -
Broadcom Advances Next-Gen 200 Terabit Switch Tapeout with 1.6T DSP and CPO Technology, Targeting $100 Billion in AI Revenue
Techstock01 | Substack USA Overview Broadcom is progressing with the tapeout of its next-generation 200 terabit switch, championing Co-Packaged Optics (CPO), 1.6 terabit DSPs, CW, and EML lasers as industry standards. The company is stra...
