NVIDIA– tag –
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SK Group Chairman Deepens AI Alliances with Nvidia and TSMC, Expanding Next-Gen HBM and Advanced Packaging Collaboration
The Korea Herald South Korea Overview SK Group Chairman Chey Tae-won has strengthened alliances with leading AI chipmakers, meeting with Nvidia CEO Jensen Huang and later with TSMC Chairman C.C. Wei in Taiwan. Discussions focused on expa... -
AMD Announces Over $10 Billion Taiwan Ecosystem Investment to Bolster AI Infrastructure and Advanced Packaging Manufacturing
Electronics Engineering Herald - EEHerald USA Overview AMD announced an investment exceeding $10 billion in Taiwan's ecosystem to expand its AI infrastructure and advanced packaging manufacturing capabilities. This significant capital in... -
TSMC CoWoS Capacity Becomes Major AI Chip Growth Bottleneck: Ramping to 120K Wafers/Month by late 2026 Still Falls Short of Demand
backplane Taiwan Overview TSMC's CoWoS packaging capacity is identified as the most critical bottleneck hindering AI chip evolution. While TSMC plans to quadruple its CoWoS production capacity from approximately 35,000 wafers/month in la... -
Lumentum Achieves 135% YTD Return in 2026 Driven by Surging Optical Transceiver Demand, InP Supply Constraints, and Expanding CPO Opportunities from NVIDIA AI Data Centers
Let's Data Science (via Seeking Alpha) USA Overview Lumentum Holdings Inc. achieved a substantial 135% year-to-date return in 2026, propelled by higher-than-expected demand for optical transceivers, supply constraints in indium phosphide... -
Nokia’s Optical Network Business Set for 31% Surge to €4 Billion by 2026, Fueled by NVIDIA’s $1B Investment and Hyperscaler AI Demand
S&P Global フィンランド Overview Nokia's optical network infrastructure revenue is projected to surge 31% year-over-year, reaching €4 billion by 2026, primarily driven by a strategic $1 billion investment from NVIDIA and escalating hyper... -
Marvell Acquires Celestial AI for $3 Billion to Secure CPO Core Technology, Expands Silicon Photonics Collaboration with NVIDIA
Global Semi Research USA Overview Marvell has strategically transformed into a key player in AI data center interconnect and custom chips by acquiring Celestial AI for approximately $3 billion in December 2025, gaining crucial Co-Package... -
Intel Foundry Unveils Advanced Packaging Innovations for AI/HPC at ECTC 2026, Revolutionizing CPO with High-Performance Detachable Optical Connectors
Intel Foundry USA Overview Intel Foundry engineers presented advanced packaging technologies at ECTC 2026, redefining AI and HPC scalability limits. They demonstrated scaling of EMIB-T packaging and showcased innovations in Co-Packaged O... -
Coherent Emphasizes Photonics as Key to AI Infrastructure Scaling, Achieving Low Power-Per-Bit and High Bandwidth Density Amidst Surging Demand
Coherent / Photonics Spectra USA Overview Coherent's Sanjai Parthasarathi highlights advanced laser and photonics technologies as central to the scalability, efficiency, and reliability of AI systems, driven by rapid AI growth and increa... -
Lightmatter Unveils 114Tbps Passage M1000 3D Photonic Interposer and 50Tbps Optical I/O Laser at InterConnect 2026, Joins NVIDIA NVLink Fusion Ecosystem
Lightmatter USA Overview At its InterConnect 2026 keynote, Lightmatter revealed a new category of lasers capable of delivering 50 Tbps of optical I/O and the Passage M1000 3D Photonic Interposer, offering 114 Tbps I/O, to enable a photon... -
Pandaily: Co-Packaged Optics (CPO) as the “Ultimate Goal” for Next-Gen AI Data Centers, Predicting Explosive NPO Adoption in 2026-27
Pandaily China Overview Pandaily reports that Co-Packaged Optics (CPO) is the core solution for next-generation AI data centers, addressing GPU communication bottlenecks. The article outlines a three-stage roadmap for optoelectronic inte...
