TGV– tag –
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Glass Substrates & TGV Technology Set to Reshape 2027 Advanced Packaging Race; US, Japan, Korea, Taiwan, China Accelerate Development
digitimes Taiwan Overview As AI chip package sizes expand, glass substrates and Through-Glass Via (TGV) technology are emerging as new focal points in advanced packaging competition. Supply chain leaders in the US, Japan, South Korea, Ta... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging Mass Production
Asianews.network Germany Overview Germany's TRUMPF announced a breakthrough in Through Glass Via (TGV) coating for glass substrates, a critical bottleneck, by leveraging its high-power HiPIMS (High Power Impulse Magnetron Sputtering) tec... -
Unimicron Reports 90% Surge in Equipment Demand from AI, Japanese SME Dependence on ABF Substrates Creates Bottleneck
BigGo Finance Taiwan Overview Unimicron Technology Chairman Chien Shan-Chieh stated that escalating AI demand has severely impacted the substrate sector, worsening supply-demand imbalance due to heavy reliance on small and medium-sized J... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
Glass Substrates in Advanced Packaging Accelerate from Prototype to Mass Production, Emerging as Key Technology for HBM and Chiplet Integration
Solid State Technology USA Overview Advanced packaging technology utilizing glass substrates is rapidly transitioning from R&D to mass production within the semiconductor industry. Glass substrates, superior to conventional organic s... -
imec Pioneers Glass Substrates for Next-Gen 3D Packaging, Accelerating AI/HPC Commercialization
EETimes Belgium Overview imec, the renowned Belgian microelectronics research institute, has announced a significant breakthrough in 3D stacked packaging, leveraging glass substrates as interposers. This innovation is pivotal for next-ge... -
Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory
Chinadaily.com.cn China Overview Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased ... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin... -
South Korea’s JNTC and Japan’s TOPPAN Announce Partnership for AI Chip Glass Substrate Technology, Overcoming Organic Substrate Limits for Next-Gen Packaging
Tai (via Semiconductor News) South Korea Overview South Korea's JNTC and Japan's TOPPAN have forged a strategic partnership for next-generation glass substrate technology aimed at AI chips. As advanced packages integrating AI accelerator...
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