Wafer Level Packaging– tag –
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Researchers Develop Wafer-Scale Bonded Active Photonics Interposer: Pioneering Low-Loss, High-Bandwidth Optoelectronic Integration
EurekAlert! USA Overview Researchers have developed a wafer-scale bonded active photonics interposer that integrates photonic devices with electronic circuits at the wafer level, enabling low-loss, high-bandwidth communication with mass ... -
Laser Debonding Technology Becomes Critical for Improving Thin Wafer Yield in HBM and Hybrid Bonding
Microtreat Global Overview Laser debonding is gaining importance as the cleanest and least damaging wafer separation technology for high-value 3D integration and advanced packaging. For ultra-thin wafers (20-50 micrometers) in HBM, chipl... -
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo... -
Powertech Aims for Early 2027 Launch of World’s First AI Server Panel-Level Packaging Mass Production
Tonarism Taiwan Overview Powertech Technology, a leading Taiwanese OSAT, has unveiled plans to commence mass production of panel-level packaging (PLP) for AI semiconductors and server CPUs by early 2027. This initiative establishes the w... -
IMAPS Device Packaging Conference 2026 Details 3D/2.5D Packaging Advances: FOPLP, Hybrid Bonding Drive Demand
IMAPS USA Overview Professional Development Courses at IMAPS Device Packaging Conference 2026 provided in-depth insights into current and future 3D/2.5D packaging processes and technologies. Key innovations like Fan-Out Panel Level Packa... -
ACM Research Secures Production and Evaluation Orders for Ultra ECP ap-p Horizontal Panel Electroplating Tool, Supporting 600x600mm Panels
GlobeNewswire USA Overview ACM Research announced securing production and evaluation orders from two advanced packaging customers for its Ultra ECP ap-p horizontal panel-level electroplating tool. This innovative tool supports large pane... -
Qnity Electronics Accelerates AI-Centric Advanced Packaging R&D with Expanded imec Collaboration
Converge Digest Belgium Overview Qnity Electronics has significantly expanded its strategic collaboration with imec, a world leader in nanoelectronics, to bolster long-term R&D in advanced semiconductor packaging crucial for AI and h... -
ASMPT’s Advanced Packaging Business Achieves Record Sales in H1 2026, Driven by Surging AI Demand
ASMPT Singapore Overview ASMPT reported robust financial results for the first half of 2026, with its Advanced Packaging (AP) business achieving record sales, significantly propelled by escalating AI demand. Key contributors included The... -
ASE Technology Bets Big on AI: $10.5 Billion Record Capex to Double Advanced Packaging by 2027
TrendForce Taiwan Overview ASE Technology Holding is significantly increasing its 2026 capital expenditure to a record $10.5 billion, aiming to double the revenue of its leading-edge advanced packaging (LEAP) business by 2027. This ambit... -
Chiplet Underfill Dispensing Market to Grow Through 2036 Driven by HBM and C2W Hybrid Bonding Void Reduction Needs
Fact.MR USA Overview This article summarizes a market research report from Fact.MR. The chiplet underfill dispensing market is growing, driven by the need for wafer-level underfill in HBM manufacturing and tailored viscosity/cure profile...
