Wafer Level Packaging– tag –
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Wafer-Level Packaging: Scaling to $28 Billion by 2035 Amidst Miniaturization Demands
Market Research Unknown Overview A new market research report forecasts the Wafer Level Packaging (WLP) market to surge from $11.97 billion in 2026 to $28.81 billion by 2035. This substantial growth is primarily driven by the relentless ... -
Powertech and Broadcom Launch $400M Singapore Joint Venture to Expand FOPLP Manufacturing for AI ASICs
Taipei Times Taiwan Overview Powertech Technology has approved a $400 million joint venture with Broadcom in Singapore to establish advanced Panel-Level Packaging (PLP) manufacturing capabilities, focusing on additive fine-line RDL techn... -
SK Hynix Reapproves 7.1 Trillion Won Investment for Cheongju P&T7, Significantly Bolstering Advanced Packaging Capacity for HBM and AI Memory
The Elec South Korea Overview SK Hynix has reapproved a 7.1 trillion won (approximately $5.5 billion) investment for its Cheongju P&T7 project, aiming to significantly bolster its advanced packaging capacity for AI memory products, i... -
Taiwan’s Grand Process Technology Partners with Germany’s Singulus to Enter Panel-Level Packaging (PLP) Market, Offering AI/HPC Solutions
Taiwan News Taiwan Overview Taiwan's Grand Process Technology Corp. announced its entry into the panel-level packaging (PLP) market through a strategic alliance with its subsidiary Challentech International Corp. and Germany's Singulus T... -
Sumitomo Bakelite Realigns 2026 CapEx to Asian Fabrication Nodes as 35.7% Operating Profit Expansion Signals Structural De-commoditization in Semiconductor Encapsulation Materials
HDIN Research Japan Overview Sumitomo Bakelite has announced a strategic realignment of its 2026 capital expenditures, focusing on semiconductor encapsulation material manufacturing sites in Asia. The company reported a significant 35.7%... -
New Underfill Material Enables High-Performance Chiplet Integration in Fan-Out Wafer-Level Packaging
Semiconductor Packaging News Global Overview A new underfill material designed for Fan-Out Wafer-Level Packaging (FOWLP) has been developed, enabling next-generation high-performance chiplet integration. This material combines excellent ... -
Lam Research Forges Advanced Packaging Future with Wafer-to-Panel Processing Expansion
Lam Research Newsroom USA Overview Lam Research is actively shaping the future of advanced packaging by expanding its wafer-to-panel processing technologies. The company is developing new platforms and processes for larger panel substrat... -
ASE to Commence FOPLP Mass Production by End-2026, Launching 15 Expansion Projects Amid AI Chip Boom
TrendForce Taiwan Overview ASE Technology, the world's largest semiconductor packaging and testing services provider, announced plans to begin mass production of Fan-out Panel-Level Packaging (FOPLP) by the end of 2026. This initiative, ... -
Henkel Offers Liquid Compression Molding (LCM) Solutions for Wafer-Level and Panel-Level Packaging
Henkel Adhesives Germany Overview Henkel provides encapsulation materials that enable advanced semiconductor packaging technologies where ICs are molded directly on wafers or panels prior to subsequent processing, using Liquid Compressio... -
TSMC Accelerates CoPoS Packaging with Glass Core Substrates: Targets 30% Cost Reduction, >90% Wafer Utilization Post-2028
Wccftech / CHOSUNBIZ / BigGo Finance Taiwan Overview TSMC is accelerating the development of CoPoS packaging, a successor to CoWoS, leveraging glass core substrates co-developed with Ibiden and Innolux. This panel-level packaging approac...
