Key Findings
AI chip packaging is shifting toward larger sizes to integrate more Chiplets and HBM. Nvidia’s Blackwell GPU has reached approximately 3.3x the reticle limit, with the next-generation Rubin platform expected to reach 4x. TSMC’s CoWoS-L is projected to remain the dominant advanced packaging solution through 2028 due to its technical maturity and yield advantages, although Intel’s EMIB-T is positioning itself as a competitive alternative.
Technical Details
TSMC utilizes three CoWoS variants: CoWoS-S (large-area silicon interposer), CoWoS-R (redistribution layer/RDL), and CoWoS-L. CoWoS-L combines these by embedding local silicon interconnect (LSI) dies within the RDL. This allows high-density routing only where needed (e.g., SoC-to-HBM), reducing cost and complexity compared to full silicon interposers. TSMC mass-produced 3.5x reticle CoWoS-L in 2024 and plans to mass-produce a 5.5x reticle solution in 2026.
Intel’s EMIB-T embeds small silicon bridges in the package substrate rather than using a full interposer. The “T” upgrade adds through-silicon vias (TSVs) for vertical power delivery. At ECTC 2026, Intel presented a solution with a 25-micrometer first-layer interconnect bump pitch and a package size of 120mm x 120mm, supporting over 9 reticle areas of chips and 12Gb/s HBM4e.
Background and Context
Package sizes have grown steadily; TSMC’s CoWoS silicon interposers evolved from 1.5x reticle size (1,287 square millimeters) in 2016 to 3.3x (2,831 square millimeters) today. Equipment is adapting to this trend, such as HANMI Semiconductor’s FC Bonder 75, which supports 75mm x 75mm packaging compared to the conventional 20mm x 20mm. High-end GPU shipments for Nvidia are expected to grow 30% year-on-year in 2026, while AMD will push MI400 and MI450 in the second half of 2026.
Significance and Outlook
Adoption patterns are diverging by provider. Nvidia, AMD, and Meta (MTIA 400) already use CoWoS-L, with Microsoft and AWS expected to adopt it in 2027. Conversely, Google is expected to adopt EMIB-T in 2027, and AWS is currently testing EMIB technology.
Source: https://finance.biggo.com/news/4eb5b699-fd87-4922-8d26-0463a5d2360e
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