Key Findings
Eco-Optical has been recognized for its technical capabilities in the TGV (Through Glass Via) process inspection field, receiving the “2026 Annual Glass Substrate TGV Excellent Enterprise Award” at the 2026 Shenzhen International Touch and Display Exhibition. The company’s solutions address critical inspection difficulties in advanced packaging, specifically substrate morphology fluctuations and uneven via depths.
Technical Details
To ensure clear imaging of via morphology and internal wall defects, Eco-Optical utilizes an intelligent autofocus system with the following specifications:
- Sampling Speed: 6.3kHz high-speed defocus sampling.
- Precision: Sub-micron level tracking accuracy.
- Field of View: Supports a maximum target surface field of 66mm.
This system dynamically compensates for height deviations in glass substrates during high-speed scanning. Additionally, the company offers a linear spectral confocal sensor featuring a coaxial optical design for zero-shadow 3D online inspection. This sensor provides sub-micron measurement precision suitable for measuring flexible circuit board morphology, curved screen edge contours, and glue path thickness.
Background and Context
The technology was showcased at the 2026 Shenzhen International Touch and Display Exhibition, an event focusing on Micro-LED, AI computing optical interconnects, and glass substrate advanced packaging. Beyond TGV, Eco-Optical’s autofocus system is applicable to OLED substrate inspection, LED screen crack detection, and optical fiber end-face inspection, addressing issues related to object deformation, tilt, and defocusing caused by transparent materials.
Significance and Outlook
The implementation of these sensing solutions in glass substrate advanced packaging production lines provides stable industrial sensing support for TGV process quality control. By offering high-precision and high-stability solutions for the display and optical interconnect industries, the company aims to support quality upgrades across the supply chain, particularly in AI computing optical interconnects and new display technologies.
Source: https://www.gongkong.com/news/202611/454355.html
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