CoWoS– tag –
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Google’s Next-Gen TPUs Adopt Intel EMIB Packaging, Achieve Yield Targets in First Mass Production
digitimes Taiwan Overview Google has successfully implemented Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technology for mass production of its next-generation TPUs, already achieving yield targets. This strategic mov... -
Semiconductor Foundries Evolve Role, Driving Industrialization of Silicon Photonics and Advanced Heterogeneous Integration
Design And Reuse USA Overview Semiconductor foundries are shifting their role from pure transistor manufacturing to providing advanced packaging and heterogeneous integration solutions. This evolution is crucial for the burgeoning chiple... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ... -
Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
AI Chip Race Shifts to Advanced Packaging as 130M Accelerators Ship; TSMC’s CoWoS Dominates, Intel Pursues Alternatives
The Korea Economic Daily South Korea Overview The competitive landscape in the AI semiconductor market is shifting from process nodes to advanced packaging, with over 130 million AI accelerators projected to ship with advanced-packaged o... -
Global Semiconductor Sales Soar 2.2x to Record $134.5 Billion in June 2026; TSMC Achieves Over 99% CoWoS Yield But Flags HBM and ABF Substrate Bottlenecks
Amiko Consulting Japan Overview Global semiconductor sales reached an unprecedented monthly high of $134.5 billion in June 2026, marking a 2.2-fold increase year-over-year, driven by a dramatic surge in AI data center investments across ... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ... -
HBM Supply Crisis of 2026 Projected to Persist Until 2027, Redefining AI Hardware Deployment Bottleneck
EnkiAI USA Overview Explosive growth in the AI sector has triggered a structural HBM supply crisis, making it the primary bottleneck for AI hardware deployment throughout 2026, projected to last until at least 2027. The market has shifte... -
2026 Chip Crisis Sounds Hardware Wake-Up Call: AI Demand Reshaping Semiconductor Supply Chains
Trax Technologies USA Overview The 2026 chip crisis highlighted modern supply chains' deep reliance on semiconductor availability, where chip access dictates the viability and growth of AI accelerators, warehouse robots, autonomous vehic...
