CoWoS– tag –
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APC 2026: Advanced Packaging, Interconnects, and Chiplets Propel AI Systems Beyond Traditional Scaling
SEMI Europe Europe Overview The Advanced Packaging Conference (APC) 2026 convened to address the critical role of power delivery and interconnect innovations in driving AI system performance. As traditional device scaling approaches its ... -
TSMC Achieves 98-99% Yield for AI Products on CoWoS 5.5x Process, Targets 14x Reticle Size Expansion by 2029
Wccftech Taiwan Overview TSMC Vice President Ho Chun announced remarkable 98% to 99% yields for multiple AI-related products assembled using the CoWoS 5.5x process. This exceptional achievement highlights TSMC's manufacturing prowess in ... -
TSMC Doubles Advanced Packaging Capacity Over Three Years; Samsung Expands 2nm & Advanced Packaging Collaboration with Broadcom
BigGo Finance Taiwan Overview TSMC revealed it has doubled its advanced packaging capacity annually for the past three years but still lags behind surging AI chip demand, operating 10 dedicated facilities globally. Meanwhile, Samsung Ele... -
TSMC CoWoS & SoIC Packaging Become Primary AI Chip Bottleneck, Forecasting 10-20% Global Supply Shortfall by 2027 Amidst Doubling Demand
Exponential Industry Taiwan Overview TSMC's CoWoS and SoIC packaging technologies are identified as the primary physical constraints in AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wa... -
JEDEC Relaxes HBM4 Package Height to 775 µm, Enabling 12-Hi/16-Hi Stacks Without Immediate Cu-Cu Hybrid Bonding
Exponential Industry USA Overview JEDEC has relaxed the HBM4 package height specification from 720 µm to 775 µm, allowing for 12-Hi and 16-Hi stack HBM modules without immediate reliance on Cu-Cu hybrid bonding. HBM utilizes 3D stacked D... -
KLA Forecasts $1.1 Billion in Advanced Packaging Revenue for 2026, Driven by Surging AI and HBM Demand
Quartz USA Overview KLA Corporation anticipates its advanced packaging business revenue will reach approximately $1.1 billion in 2026, representing over 70% year-over-year growth, fueled by increasing AI infrastructure investments and se... -
AI Demand Strains CoWoS and SoIC Supply: Global Demand to Double to Over 2.5M Wafers by 2027, Facing 10-20% Shortfall
Exponential Industry USA Overview TSMC's CoWoS and SoIC advanced packaging technologies are now the primary physical constraints for AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wafer... -
NVIDIA Accelerates Feynman AI Platform; TSMC Ramps SoIC Capacity to 50K Wafers/Month by 2027
Benzinga Taiwan Overview NVIDIA is expediting the roadmap for its next-generation Feynman AI platform, prompting TSMC to significantly boost its advanced packaging capabilities. TSMC is rapidly expanding its SoIC technology production, a... -
TSMC Achieves Over 98% CoWoS Yield; ABF Substrates Emerge as Next Bottleneck for AI Chip Expansion
Xenospectrum Taiwan Overview TSMC has announced that its advanced CoWoS packaging technology, particularly for 5.5x reticle AI chip products, consistently achieves yields exceeding 98%. While CoWoS capacity has doubled annually for three... -
NVIDIA and Broadcom Dominate 2026 CPO Supply Chain; TSMC’s COUPE Capacity Prioritized for AI Accelerators
SupplyICs USA Overview The 2026 Co-Packaged Optics (CPO) supply chain is facing severe challenges, characterized by a concentrated production landscape where NVIDIA and Broadcom largely control key platforms. A critical bottleneck stems ...
