CoWoS– tag –
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High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Intel’s EMIB-T Advanced Packaging Projected for Significant Contribution by 2029 as CoWoS Constraints Drive Google’s Interest
TrendForce Taiwan Overview Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology, particularly EMIB-T, is attracting strong interest from major tech firms like Google amid persistent TSMC CoWoS supply constraints. Intel projec... -
AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
Scientech Forecasts 50% Shipment Growth Driven by AI Demand, Targets Next-Gen CoPoS Market Entry
Taipei Times Taiwan Overview Scientech, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-over-year increase in shipments this year, fueled by robust AI application demand and rapid technol... -
TSMC Establishes Kaohsiung Advanced Packaging Cluster, Aims for Up to 50% Efficiency Gains
digitimes Taiwan Overview TSMC announced the establishment of an advanced packaging materials and equipment supply chain cluster in Kaohsiung's Baipu Industrial Park, Taiwan. This strategic move aims to enhance efficiency in advanced pac... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
TSMC Predicts Silicon Photonics to Dominar Over Half of Optical Transceiver Market by 2027, Driven by Exploding AI Infrastructure Demand
IN Electronics & Design Taiwan Overview TSMC forecasts that silicon photonics will account for over 50% of the optical transceiver market by 2027, propelled by the accelerated adoption of optical links in AI infrastructure. Their CO-UPE ... -
KLA Unveils AI-Powered High-Speed, High-Precision Defect Inspection Solution to Boost Yield in Advanced Packages like CoWoS
SEMI Global USA Overview KLA has introduced a new AI-powered inspection system for high-speed, high-precision defect detection in high-density RDLs and 3D stacked structures. This solution supports yield management in advanced packaging ...
