Hybrid Bonding– tag –
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KLA’s Advanced Packaging Business Set for $1.1 Billion Revenue, 70%+ Growth Driven by AI Demand and Yield Bottleneck Resolution
Quartz USA Overview KLA is significantly benefiting from accelerating demand for advanced packaging inspection, metrology, and process control tools due to the increasing complexity of AI/HPC chips and hybrid bonding advancements. Its ad... -
Applied Materials Unveils New Hybrid Bonding Platform for High-Volume 3D Stacked Chip Manufacturing, Enabling Ultra-Fine Pitch Integration
Business Wire USA Overview Applied Materials has launched a new hybrid bonding platform designed for high-volume manufacturing of next-generation 3D stacked chips. This innovative system achieves high-precision alignment and high through... -
ASMPT to Showcase Advanced Thermocompression and Hybrid Bonding Innovations for HPC and AI at SEMICON Taiwan 2026
ASMPT SEMI Solutions Taiwan Overview Global technology leader ASMPT announced it will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, supporting HPC, AI accelerators, silicon photonics, and Co-Packaged Optics (CPO) appl... -
Rapidus Targets 600mm Panel-Level Packaging and 8-Reticle Interposers by 2030 for Advanced AI/HPC Systems
TrendForce Japan Overview Rapidus announced an accelerated advanced packaging roadmap aiming for 600mm panel-level packaging and 8-reticle interposers by 2030. The company has fully activated its Rapidus Chiplet Solutions (RCS) pilot lin... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK Hynix Secures HBM4 Future: 70% Price Surge, 2026 Capacity Sold Out, and $3.87B US Investment for Advanced Packaging Independence
Adalytica and others South Korea Overview SK Hynix has signaled its dominance in the High Bandwidth Memory (HBM) market by reportedly increasing HBM4 prices by 70% for its 2026 supply, which is already entirely presold. Concurrent with t... -
2026 ECTC Highlights: Applied Materials and Partners Pioneer Hybrid Bonding with Fine-Pitch Copper and Ultra-Low Temperature Annealing
Semiconductor Digest USA Overview The 2026 Electronic Components Technology Conference (ECTC) showcased significant advancements in hybrid bonding by Applied Materials, EV Group, imec, and Leti. Key breakthroughs include improved bonding... -
IMAPS Device Packaging Conference 2026 Details 3D/2.5D Packaging Advances: FOPLP, Hybrid Bonding Drive Demand
IMAPS USA Overview Professional Development Courses at IMAPS Device Packaging Conference 2026 provided in-depth insights into current and future 3D/2.5D packaging processes and technologies. Key innovations like Fan-Out Panel Level Packa...
