SK Hynix– tag –
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NVIDIA Locks Down Multi-Year HBM Supply Deals, Anticipating Persistent Shortages Beyond 2028
gagadget.com USA Overview NVIDIA CEO Jensen Huang recently visited South Korea, securing multi-year agreements with key partners including SK Hynix, SK Telecom, Naver, and Doosan Group for High Bandwidth Memory (HBM) supply, AI cloud inf... -
Samsung to Establish Gwangju Advanced Packaging Facility, Eyes Full HBM Hybrid Bonding Transition by 2029
TrendForce South Korea Overview Samsung Electronics is reportedly considering a new advanced semiconductor packaging plant in Gwangju, South Korea, with investment plans potentially announced by June 2026. This strategic facility will fo... -
SK Hynix Boosts HBM4 Production with Major TC Bonder Order from Hanmi Semiconductor
The Korea Herald South Korea Overview SK Hynix has made a significant investment, ordering ₩44.2 billion (approx. $28.7 million USD) worth of advanced 'TC Bonder 4.5 Griffin' thermo-compression bonders from Hanmi Semiconductor. This stra... -
SK Group Chairman Deepens AI Alliances with Nvidia and TSMC, Expanding Next-Gen HBM and Advanced Packaging Collaboration
The Korea Herald South Korea Overview SK Group Chairman Chey Tae-won has strengthened alliances with leading AI chipmakers, meeting with Nvidia CEO Jensen Huang and later with TSMC Chairman C.C. Wei in Taiwan. Discussions focused on expa... -
Samsung Electronics Begins Shipment of Industry’s First 12-Layer HBM4E Samples, Improving Energy Efficiency by 16% and Thermal Resistance by 14% Over HBM4
Samsung Electronics South Korea Overview Samsung Electronics has commenced shipments of industry-first 12-layer HBM4E samples to key global customers. This HBM4E improves energy efficiency by 16% and thermal resistance by over 14% compar... -
KLA’s Advanced Packaging Business Soars, Projecting Over $1.3B Revenue in FY2026 Driven by AI Inspection Demand
Bitget USA Overview KLA Corporation, a global leader in semiconductor process control and yield management, is experiencing rapid growth in its advanced packaging business, driven by the increasing complexity of AI chips. Revenue from th... -
Korea Addresses HBM Test Equipment Bottleneck by Fostering Domestic Suppliers
eferix.substack.com South Korea Overview South Korea has identified the HBM test equipment bottleneck, historically dominated by foreign companies like Advantest and Teradyne, as a national supply chain vulnerability. In response, SK Hyn... -
NVIDIA’s CoWoS Bottleneck Eases, HBM Supply Emerges as Primary Constraint for AI Accelerators
24/7 Wall St. USA Overview TSMC's CoWoS advanced packaging capacity for AI accelerators is expanding, projected to reach 35,000 wafers/month by late 2026 and up to 140,000 wafers/month by 2027, alleviating a long-standing bottleneck. How... -
Hanmi Semiconductor Forecasts HBM4 TC Bonder Rebound in Q2, Announces US Expansion Plans
BigGo Finance South Korea Overview Hanmi Semiconductor anticipates a significant rebound in HBM4 TC bonder orders from Q2 2026, driven by accelerating AI semiconductor demand, despite a Q1 slump during the HBM3E-to-HBM4 transition. The c... -
SK Hynix and Samsung Unveil Production-Ready HBM4 with Hybrid Bonding, Targeting H2 2026 Mass Production
Techfund South Korea Overview At CES 2026, SK Hynix showcased a 16-layer, 48GB HBM4 device leveraging advanced Through-Silicon Via (TSV) and hybrid bonding for high density, while Samsung presented a 12-layer, 36GB HBM4 stack focused on ...
