Key Findings
The study demonstrates that power chips can be directly bonded to non-metallized, fiber-reinforced cyanate ester composite substrates using low-temperature nano-silver sintering. The joints reached a maximum shear strength of 11.5 MPa. Long-term reliability tests showed that after 600 h of high-temperature aging, the shear strength remained at 9.3 MPa, representing a decrease of approximately 19%.
Technical Details
The sintering process resulted in Ag particles coalescing on the composite surface to form a mechanically bonded heterogeneous interface. The porosity of the sintered Ag layer varied based on the applied pressure during the 15 min sintering process:
- At 15 MPa, the porosity was 10.1%.
- At 20 MPa, the porosity decreased to 6.5%.
Analysis of the failure modes revealed a shift over time. Initial failures occurred at the Ag/composite interface, but as aging progressed, the failure mode shifted toward cracking and delamination within the composite substrate itself.
Background & Context
Integrating power chips with polymer composites is a priority for applications requiring lightweight materials, thermal stability, and low-dielectric properties. Cyanate ester composites serve as the substrate in this research to evaluate the feasibility of direct nano-silver bonding without the need for prior metallization.
Significance & Outlook
The results confirm the feasibility of using low-temperature nano-silver sintering for bonding power chips to cyanate ester composites. However, the study identifies that the principal limitation on long-term joint reliability is the thermal degradation of the substrate rather than the silver joint itself.
Source: https://doi.org/10.21203/rs.3.rs-11259596/v1
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