Semiconductor Back-End– category –
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Malaysia Launches National Consortium to Accelerate Advanced Semiconductor Packaging Development Within Two Years
SME.asia Malaysia Overview Malaysia has established the Malaysia Advanced Packaging Consortium (MAPC) with a total funding of RM185 million ($39 million USD) to develop domestic advanced semiconductor packaging capabilities within two ye... -
SK Hynix and Samsung Unveil Production-Ready HBM4 with Hybrid Bonding, Targeting H2 2026 Mass Production
Techfund South Korea Overview At CES 2026, SK Hynix showcased a 16-layer, 48GB HBM4 device leveraging advanced Through-Silicon Via (TSV) and hybrid bonding for high density, while Samsung presented a 12-layer, 36GB HBM4 stack focused on ... -
AMD Commits Over $10 Billion to Taiwan’s AI Ecosystem for Advanced Packaging and EFB Technology Expansion
EE Times Taiwan Overview AMD announced an investment exceeding $10 billion into Taiwan's AI ecosystem, bolstering advanced packaging capabilities and R&D. This initiative specifically targets Elevated Fanout Bridge (EFB) based 2.5D p... -
TSMC Repurposes Mature Node Capacity to CoWoS for AI Accelerators Amid Critical Supply Shortage
Tom's Hardware Taiwan Overview TSMC is reallocating 40-90nm mature node capacity to expand its CoWoS advanced packaging and silicon interposer fabrication, directly addressing a critical supply bottleneck for AI accelerators. This strate... -
Amkor Technology Targets $11B Revenue by 2030, Anchored by $7 Billion Arizona Advanced Packaging Investment
MarketBeat USA Overview Amkor Technology aims to exceed $11 billion in revenue by 2030, driven by a $7 billion, two-phase investment in its Arizona advanced packaging and test campus. High-volume manufacturing is slated to begin in 2028,... -
Semiconductor Back-End Weekly Report May 24, 2026
🎙 Podcast May 24, 2026 (MP3) — Play & Download Semiconductor_BackEndEnglishPodcast_20260524.mp3Download View Past Weekly Reports→ -
Camtek’s Precision Inspection and Metrology Solutions Drive Yield and Efficiency in Advanced Packaging
Camtek イスラエル Overview Camtek provides industry-leading 2D and 3D inspection and metrology platforms that address the escalating complexity and rapid growth of the advanced packaging market. Featuring sub-micron defect detection, CAD... -
Rapidus Explores Panel-Level Packaging on Glass Substrates for Next-Gen AI/HPC Processors
Tom's Hardware Japan Overview Japanese semiconductor firm Rapidus is actively exploring the adoption of panel-level packaging (PLP) on large 600mm x 600mm glass panels for manufacturing high-end multi-chiplet processors designed for AI a... -
KLA Enhances AI Chip Production with Comprehensive Wafer Inspection and Metrology for Advanced Packaging
KLA USA Overview KLA offers comprehensive inspection and metrology solutions for complex advanced wafer-level packaging processes, including 2.5D/3D integration, WLCSP, and FOWLP. Its AI-powered systems improve yield, defect detection, a... -
Rapidus to Launch Advanced Packaging Pilot Line in Hokkaido by Spring 2026, Accelerating AI Chip Development
Sic-chip.com (via Digitimes) Japan Overview Japanese semiconductor manufacturer Rapidus is accelerating the development of advanced packaging solutions for AI chips, with plans to commence pilot production at its advanced packaging line ...
