Chiplet– tag –
-
Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026 in Suwon, Korea, to Cover Advanced Packaging, Chiplets, and HBM
Advanced Semiconductor Packaging & Chiplet Show (ASPS) South Korea Overview The Advanced Semiconductor Packaging & Chiplet Show (ASPS) will take place from August 26-28, 2026, at the Suwon Convention Center in South Korea. This B2B e... -
IMAPS Device Packaging Conference 2026 PDCs Focus on Advanced Packaging for Chiplets and Heterogeneous Integration, Highlighting Hybrid Bonding
IMAPS USA Overview IMAPS Device Packaging Conference 2026 Professional Development Courses (PDCs) extensively covered "Advanced Packaging for Chiplets and Heterogeneous Integration." The courses defined various 2D to 3.5D IC integrations... -
AI’s Performance Breakthrough: Advanced Packaging, Power, and Interconnects Take Center Stage at SEMI Europe 2026
SEMI Europe Europe Overview SEMI Europe's 2026 Advanced Packaging Conference (APC) will spotlight 'Power and Interconnects Innovations Enabling AI System Performance,' emphasizing advanced packaging (AP) and test as crucial for scaling n... -
A*STAR Accelerates Advanced Optical Interconnect Development for Co-Packaged Optics (CPO) in Singapore
MyCareersFuture Singapore Overview A*STAR Research Entities in Singapore are seeking a Senior Scientist to accelerate the development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms. This role invol... -
CPO Shipments Intensify as Four Foundries Pursue Diverse Paths in Next-Gen Optical Integration
MLQ News Global Overview As Co-Packaged Optics (CPO) shipments scale up, four major semiconductor foundries—TSMC, Intel, Samsung Foundry, and GlobalFoundries—are pursuing distinct strategies for next-generation optical integration. TSMC ... -
Marvell Unveils Photonic Fabric Products Post-Celestial AI Acquisition, Fortifying AI Memory Infrastructure
Technologies.org USA Overview Following its acquisition of Celestial AI in February 2026, Marvell has launched new AI memory infrastructure products, including Photonic Fabric memory modules, NICs, and chiplets. These offerings aim to bo... -
Ayar Labs’ UCIe-Compatible ‘TeraPHY’ Optical I/O Engine Extends AI Scale-Up Beyond the Rack, Strengthening Ecosystem Partnerships
TechArena Forum USA Overview Ayar Labs announced its "TeraPHY" optical I/O engine, built on silicon photonics and standard CMOS, connects via a UCIe-based electrical interface to enable AI scale-up beyond single-rack constraints. The com... -
Lightmatter and Qualcomm Collaborate to Develop 1.6 Tbps/Fiber CPO Chiplet, Resolving AI Training’s Electrical Bottleneck
alchedek USA Overview Lightmatter, in strategic collaboration with Qualcomm Technologies, has achieved 1.6 Tbps/fiber unidirectional throughput with its Passage L-Series Co-Packaged Optics (CPO) chiplet. This breakthrough chiplet leverag... -
AI Photonic Interconnect Startup Lumilens Raises Over $700 Million in Series C to Accelerate Chip-to-Chip Data Transfer for AI
Wowtale USA Overview Lumilens, an AI photonic interconnect startup, successfully closed a Series C funding round with over $700 million, accelerating its development of advanced optical connectivity solutions for faster and more efficien... -
Major Foundries Advance CPO Roadmaps as NVIDIA Spectrum-X and Broadcom Taurus BCM83640 Enter Mass Production and 400G/Lane DSP Era
Tom's Hardware USA Overview Leading foundries (TSMC, Intel, Samsung, GlobalFoundries) are aggressively pursuing Co-Packaged Optics (CPO) roadmaps to address scale-up connectivity bottlenecks in AI clusters. NVIDIA has initiated mass prod...
