Heterogeneous Integration– tag –
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API Unveils GEMINI PRO, NUERA PRO, and AP-M3500 Bonding Platforms for Next-Gen Semiconductors at SEMICON Taiwan 2026, Addressing Key Packaging Bottlenecks
API (Advanced Packaging Intelligence) Unknown Overview API (Advanced Packaging Intelligence) reported a successful exhibition of next-generation advanced packaging technologies at SEMICON Taiwan 2026. Their GEMINI PRO, NUERA PRO, and AP-... -
STMicroelectronics Unveils Modular SiP Solution for Automotive AI Market, Driving Miniaturization and Performance in Autonomous Driving and ADAS
Electronics Weekly Switzerland/France Overview STMicroelectronics has launched a new modular System-in-Package (SiP) solution specifically designed for automotive AI applications. This solution integrates multiple chips to reduce footpri... -
Infineon Strengthens Advanced Packaging Collaboration in Europe under EU Chips Act, Building Chiplet and Heterogeneous Integration Supply Chain
Reuters Germany Overview Infineon announced strengthened partnerships for advanced packaging technology development within Europe, leveraging the EU Chips Act. This strategy aims to build an indigenous supply chain for chiplet technology... -
imec Pioneers Glass Substrates for Next-Gen 3D Packaging, Accelerating AI/HPC Commercialization
EETimes Belgium Overview imec, the renowned Belgian microelectronics research institute, has announced a significant breakthrough in 3D stacked packaging, leveraging glass substrates as interposers. This innovation is pivotal for next-ge... -
Japan Introduces New Subsidy Program for Advanced Packaging R&D, Focusing on Heterogeneous Integration and 3D Stacking to Enhance Competitiveness
METI Press Release Japan Overview Japan's Ministry of Economy, Trade and Industry (METI) unveiled a new subsidy program to support R&D and mass production investment in advanced packaging technologies for strengthening the domestic s... -
Global Semiconductor Capital Investment to Surge 30% to $240 Billion in 2026, Driven by AI Inference Demand; Advanced Packaging Fuels Multi-Year Double-Digit Growth
Soka Technology Unknown Overview The global semiconductor industry is projected to enter an unprecedented capital investment supercycle in 2026, driven by a skyrocketing demand for AI inference capabilities. Industry forecasts estimate t... -
APC 2026: Advanced Packaging, Interconnects, and Chiplets Propel AI Systems Beyond Traditional Scaling
SEMI Europe Europe Overview The Advanced Packaging Conference (APC) 2026 convened to address the critical role of power delivery and interconnect innovations in driving AI system performance. As traditional device scaling approaches its ... -
ECTC 2026 Highlights Advanced Packaging Future: Glass Substrates and FOPLP at the Core of System Innovation
Advanced Packaging Magazine USA Overview ECTC 2026 emphasized a structural shift in semiconductor innovation, moving beyond transistor scaling to packaging and integration technologies. Noteworthy advancements in heterogeneous integratio... -
IMAPS Device Packaging Conference 2026 PDCs Focus on Advanced Packaging for Chiplets and Heterogeneous Integration, Highlighting Hybrid Bonding
IMAPS USA Overview IMAPS Device Packaging Conference 2026 Professional Development Courses (PDCs) extensively covered "Advanced Packaging for Chiplets and Heterogeneous Integration." The courses defined various 2D to 3.5D IC integrations... -
AI’s Performance Breakthrough: Advanced Packaging, Power, and Interconnects Take Center Stage at SEMI Europe 2026
SEMI Europe Europe Overview SEMI Europe's 2026 Advanced Packaging Conference (APC) will spotlight 'Power and Interconnects Innovations Enabling AI System Performance,' emphasizing advanced packaging (AP) and test as crucial for scaling n...
