Heterogeneous Integration– tag –
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EU Chips Act Allocates €210M to Bolster 3D IC Packaging R&D for Strategic Semiconductor Autonomy
The Chosun Daily EU Overview The European Union has committed €210 million under its EU Chips Act to accelerate research and development in next-generation 3D IC packaging technologies. This significant investment aims to enhance Europe'... -
Semiconductor Startup Funding Diversifies Beyond AI Accelerators to Interconnects and Packaging; TSMC CoWoS Capacity to Quadruple by EOY 2026
New Market Pitch Global Overview Semiconductor startups attracted $8.4 billion in Q1 2026, pushing cumulative funding to $10.7 billion, with investments diversifying beyond AI accelerators to interconnects, optical I/O, memory, and advan... -
imec Breaks New Ground: III-V Chiplets on RF Silicon Interposer Achieve 100x Capacitance Density Boost and Sub-600nm Precision
OriginBrief ベルギー Overview imec has announced a significant breakthrough in heterogeneous integration, successfully integrating III-V chiplets onto a 300mm RF silicon interposer platform. This achievement delivers a 10-100x increase i... -
Apple’s M5 Ultra Pioneers Integration with TSMC’s N3P Process and SoIC-mH Packaging
TrendForce Taiwan Overview Reports indicate Apple's upcoming M5 Ultra chip, expected at WWDC, will likely leverage TSMC's N3P process node and its advanced SoIC-mH (System-on-Integrated-Chips – molded horizontal packaging) technology. So... -
Europe Boosts Investment in Advanced Packaging and Chiplet Integration; imec’s FAMES Pilot Line Aims to Mitigate Regional Supply Chain Risks
Astute Group UK Overview Europe is significantly increasing investment in advanced packaging and chiplet integration technologies to diversify its semiconductor supply chain and reduce regional procurement risks, shifting focus from pure... -
IEEE ECTC 2026 Highlights Packaging Technologies Redefining AI and HPC Scalability Limits
IEEE Electronic Components and Technology Conference (ECTC) USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) spotlighted packaging technologies redefining AI and HPC scalability limits. Intel Foundry's R&... -
ASMPT Establishes Advanced Packaging Technology Advisory Council to Accelerate AI-Era Innovation
ASMPT Singapore Overview ASMPT has established an Advanced Packaging Technology Advisory Council (TAC) to address the growing importance of advanced packaging for next-generation computing and AI components. The TAC will focus on a broad... -
Heterogeneous Integration Advances with Hybrid Bonding, Tackling Critical Power and Thermal Challenges for AI and 5G/6G
IndexBox Global Overview Heterogeneous integration, particularly vertical chip stacking with fine-pitch interconnects, is crucial for future AI and 5G/6G electronics, dramatically reducing data travel distances and power consumption. Hyb... -
Camtek’s Precision Inspection and Metrology Solutions Drive Yield and Efficiency in Advanced Packaging
Camtek イスラエル Overview Camtek provides industry-leading 2D and 3D inspection and metrology platforms that address the escalating complexity and rapid growth of the advanced packaging market. Featuring sub-micron defect detection, CAD... -
KLA Enhances AI Chip Production with Comprehensive Wafer Inspection and Metrology for Advanced Packaging
KLA USA Overview KLA offers comprehensive inspection and metrology solutions for complex advanced wafer-level packaging processes, including 2.5D/3D integration, WLCSP, and FOWLP. Its AI-powered systems improve yield, defect detection, a...
