Chiplet– tag –
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BE Semiconductor Industries (BESI) Raises Long-Term Revenue Target to €2.2 Billion and Operating Margin Target to 45% Amid Surging Hybrid Bonding Demand
Bits&Chips Netherlands Overview BE Semiconductor Industries (BESI) has significantly raised its long-term annual revenue target from €1.5-1.9 billion to €1.7-2.2 billion, while also increasing the lower end of its operating margin target... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Semiconductor Startup Funding Diversifies Beyond AI Accelerators to Interconnects and Packaging; TSMC CoWoS Capacity to Quadruple by EOY 2026
New Market Pitch Global Overview Semiconductor startups attracted $8.4 billion in Q1 2026, pushing cumulative funding to $10.7 billion, with investments diversifying beyond AI accelerators to interconnects, optical I/O, memory, and advan... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
Imec’s Chiplet Imperative: Analyzing the Transition to High-Bandwidth, Low-Energy AI/HPC Systems
imec ベルギー Overview Imec has published a comprehensive analysis identifying the economic and technical inflection points for transitioning from monolithic ASICs to chiplet-based designs, particularly for AI, HPC, and data center appli... -
Ayar Labs Joins NVIDIA NVLink Fusion Ecosystem to Deploy Co-Packaged Optics in Rack-Scale AI Infrastructure
Forge Global USA Overview Ayar Labs, an optical I/O data platform, announced its participation in NVIDIA's NVLink Fusion ecosystem in June 2026 to bring Co-Packaged Optics (CPO) technology to rack-scale AI infrastructure. The company aim... -
TSMC Accelerates Advanced Packaging Strategy: Addressing CoWoS Capacity Shortfall, Driving AI Accelerator Demand
Umbrex Taiwan Overview TSMC's strategy is founded on advanced process technology, manufacturing yield, reliable execution, and a broad design ecosystem. As chip architectures shift towards chiplets and 3D integration, advanced packaging ... -
Semiconductor Engineering Report Highlights AI-Driven Optical-Logic Integration and Hybrid Bonding for Increased Interconnect Density
Semiconductor Engineering USA Overview A June 2026 Semiconductor Engineering report emphasizes that AI systems are driving a closer integration of optics and logic, necessitating co-evolution in fabrication, packaging, thermal management... -
imec Breaks New Ground: III-V Chiplets on RF Silicon Interposer Achieve 100x Capacitance Density Boost and Sub-600nm Precision
OriginBrief ベルギー Overview imec has announced a significant breakthrough in heterogeneous integration, successfully integrating III-V chiplets onto a 300mm RF silicon interposer platform. This achievement delivers a 10-100x increase i...
