Chiplet– tag –
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AI-Driven Advanced Packaging Orders Surge, Widening ABF Carrier Board Supply-Demand Gap, Benefiting Industry with Both Volume and Price Increases
AlphaWire International Overview Nomura Securities reports the semiconductor packaging substrate industry is experiencing a strong AI-driven recovery, with global packaging substrate shipments up 36% year-on-year in June 2026. This growt... -
Applied Materials Highlights MES’s Critical Role in Recovering Capacity and Managing Complexity for Advanced Packaging and Test Facilities
Applied SmartFactory Solutions (Applied Materials) USA Overview Applied Materials emphasizes the crucial role of Manufacturing Execution Systems (MES) in advanced packaging and test (ATP) facilities for capacity recovery, loss reduction,... -
AI Era Semiconductor Equipment Theme: Applied Materials Forecasts Over 50% Advanced Packaging Revenue Growth in 2026, Micron Boosts HBM Packaging Capabilities
TradingKey International Overview As AI chip evolution heavily relies on chiplets and advanced packaging beyond transistor shrinkage, Applied Materials anticipates over 50% growth in its advanced packaging revenue in 2026, while KLA expe... -
Applied Materials’ Material Engineering Innovations, Led by Hybrid Bonding, Key to Scaling AI Chip Performance in the AI Era
Applied Materials (Official Blog/Article) USA Overview Applied Materials emphasizes that material engineering innovations, including its Kinex hybrid bonding system, are critical for scaling AI chip performance. The company is advancing ... -
ABF Substrates Emerge as the True Bottleneck in the AI Era, More Critical Than DRAM for High-Performance Computing
Industry Analysis International Overview ABF (Ajinomoto Build-up Film) substrates, not DRAM, are becoming the more critical bottleneck in the AI supply chain. Leading manufacturers like Ibiden and Unimicron are poised to benefit directly... -
Applied Materials Unveils Seven New Systems for AI Chip DRAM Performance and Advanced 3D Packaging, Accelerating Bottleneck Resolution
Industry News International Overview Applied Materials introduced seven new semiconductor manufacturing systems designed to address bottlenecks in AI chip production, specifically enhancing DRAM performance scaling and advanced 3D packag... -
Semiconductor Industry Pivots to Heterogeneous Large-Scale Integration (HLSI) as AI Reshapes Chip Design
Next Move Strategy Consulting (via EE Times) USA Overview Driven by surging AI workloads, the semiconductor industry is dramatically shifting beyond traditional System-on-Chip (SoC) paradigms towards Heterogeneous Large-Scale Integration... -
China’s Memory Industry Accelerates HBM3/3E Development; YMTC Leads in Wafer-to-Wafer Hybrid Bonding Patents
BloomingBit.io China Overview China's memory industry is rapidly advancing, with companies like CXMT focusing on HBM3 and HBM3E development, thereby narrowing the technology gap with South Korea. Notably, Yangtze Memory Technologies Co. ... -
Korea Institute of Industrial Technology Develops Novel Chip Integration Process Achieving 4x Commercial HBM Density
EurekAlert! South Korea Overview Researchers at the Korea Institute of Industrial Technology (KITECH) have developed an innovative chip integration process that achieves approximately four times the integration density of commercial High... -
AT&S Initiates High-Volume AI Substrate Production in Malaysia, Backed by Major Customer Commitments and Projecting Substantial Revenue Growth
boerse-social.com Austria Overview AT&S, a leading Austrian manufacturer of high-end IC substrates, has commenced high-volume production of advanced AI substrates at its new Kulim, Malaysia, facility. This expansion, supported by lon...
