KLA Forecasts $1.1 Billion in Advanced Packaging Revenue for 2026, Driven by Surging AI and HBM Demand

August 17, 2026

Quartz USA

Overview

KLA Corporation anticipates its advanced packaging business revenue will reach approximately $1.1 billion in 2026, representing over 70% year-over-year growth, fueled by increasing AI infrastructure investments and semiconductor complexity. Strong demand across CoWoS and emerging SoIC packaging technologies is driving the need for more sophisticated inspection and metrology tools to support hybrid bonding and nanometer-level precision requirements. AI expenditures, HBM, and advanced packaging are expected to continue driving KLA’s robust growth through 2027.

In Depth

Key Findings

KLA Corporation projects significant growth in its advanced packaging business, with revenue from its semiconductor process control portfolio in this segment expected to climb from approximately $635 million in 2025 to roughly $1.1 billion in 2026. This represents a robust year-over-year growth exceeding 70%, underpinned by accelerating AI infrastructure investments and the increasing complexity of semiconductor devices.

Technical / Clinical Details

KLA’s growth is primarily driven by strong demand for cutting-edge packaging technologies like TSMC’s CoWoS and the rapidly emerging SoIC. These advanced methods necessitate hybrid bonding between dies and demand extremely high precision in alignment, inspection, and metrology at the nanometer level. KLA’s process control systems are indispensable for meeting these stringent requirements, playing a critical role in defect detection and measurement at every stage of the packaging process. As semiconductor devices increase in integration and value, the structural importance of advanced process control for maximizing production yields grows, directly benefiting KLA.

Background & Context

With the explosive expansion of demand for AI and High-Performance Computing (HPC), advancements in semiconductor chip performance are now heavily reliant not only on miniaturization but also on the evolution of advanced packaging technologies. The increasing adoption of HBM (High Bandwidth Memory) and the proliferation of chiplet architectures escalate packaging complexity, thus requiring more sophisticated inspection and metrology solutions. KLA offers a comprehensive suite of process control solutions, spanning from early semiconductor manufacturing stages to back-end packaging, and has demonstrated agile responsiveness to these market shifts. Compared to competitors, KLA’s broad portfolio and technological advantages solidify its leadership in the rapidly growing advanced packaging market.

Strategic Significance & Outlook

KLA expects AI-related capital expenditures, rising HBM demand, and the expansion of the advanced packaging market to continue driving its strong revenue growth through 2027. The structural changes within the semiconductor industry, characterized by increasing device complexity and value, will permanently elevate the importance of process control. KLA’s strategy involves sustained investment in research and development to deliver solutions that address the new challenges posed by next-generation packaging technologies, thereby maintaining long-term growth. This approach is anticipated to further strengthen its dominant position in the advanced packaging market.

Source: https://qz.com/can-kla-s-advanced-packaging-strength-support-1b-revenue-target

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