SEMICONDUCTOR BACK-END KNOWLEDGE LIBRARY
Technology &
Company Guides
A visual English-language reference for semiconductor packaging and back-end manufacturing. Choose a technology term or company to open its illustrated guide and source-linked overview.
28 technology guides24 company profiles
Technology Guides
28 illustrated explainers
Bonding
Bridges & EMIB
Build-Up Film
Bumps
Chiplets
Co-Packaged Optics (CPO)
Coefficient of Thermal Expansion (CTE)
CoWoS
Die Stacking
Fan-Out & Wafer-Level Packaging
Flip Chip
Glass Substrates
Heterogeneous Integration
High Bandwidth Memory (HBM)
Hybrid Bonding
Interconnects
Interposers
OSAT
Package Substrates
Panel-Level Packaging (PLP)
Redistribution Layer (RDL)
Semiconductor Test
Silicon Photonics
System-in-Package (SiP)
Through-Silicon Via (TSV)
Underfill & Encapsulants
Vias
Wafer Thinning & Dicing
Company Profiles
24 companies
Ajinomoto
AMD
Amkor Technology
Applied Materials
ASE Group
ASMPT
BESI (BE Semiconductor Industries)
Hanmi Semiconductor
Ibiden
Intel
Kinsus
KLA Corporation
Lam Research
Micron Technology
NVIDIA
Onto Innovation
Powertech Technology
Rapidus
Samsung Electro-Mechanics
Samsung Electronics
SK hynix
SPIL
TSMC
Unimicron
The guides distinguish reported facts from interpretation and retain the source links included in each article. Illustrative diagrams are explanatory visuals and should not be read as exact manufacturing cross-sections.